New Delhi, November 6: Companies planning semiconductor fabs, chip assembly and testing units, or equipment and materials plants in India can now apply for government support, after Union Minister Ashwini Vaishnaw on Friday launched the Semicon 2.0 web application portal.
At the same event, the Ministry of Electronics and Information Technology (MeitY) announced 12 more approvals under the Electronics Component Manufacturing Scheme (ECMS), with projected investment of ₹7,503 crore.
Three Semicon 2.0 pillars open for applications
The Union Cabinet has approved Semicon 2.0 with a fiscal outlay of ₹1,27,500 crore under the India Semiconductor Mission (ISM). It rests on six pillars: chip design, machines and materials, more fabs, the ATMP/OSAT (assembly, testing, marking and packaging) industry, research and development, and talent development.
The portal is now accepting applications under Pillar 2 (machines and materials), Pillar 3 (fabs) and Pillar 4 (ATMP/OSAT).
Under the first phase, Semicon 1.0, 12 projects were approved across six states with cumulative investment of over ₹1.64 lakh crore, the ministry said. Five of them had started commercial production by October 2026.
Target to attract equipment and chemicals makers
Mr Vaishnaw said Semicon 2.0 would focus on equipment, materials, chemicals and gases, with a target of bringing at least three major equipment manufacturers and five chemicals and gases companies to India.
He said project selection must be rigorous, and that quality, technological depth, research and global competitiveness should guide decisions. He added that India’s electronics industry had moved beyond assembly towards a domestic value chain covering modules, components and materials.
“India has undergone a fundamental transformation over the past decade. However, this is just the beginning,” the Minister said.
Latest ECMS approvals
The 12 new projects are expected to produce goods worth ₹39,045 crore and create 7,127 direct jobs. They are spread across Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu and Uttar Pradesh. Nearly half of the units approved under the scheme belong to the MSME sector, Mr Vaishnaw said.
- Components: multi-layer PCBs (NeST ICELR), relays (TDConnex Chennai), heat sinks (Modern Automotives) and specialty ceramics (Voltix Semicon).
- Supply chain products: copper foil (Indo Asia Copper), anode material (TACC), cathode active material (Vidyuta Materials), polypropylene film (Enerfolie) and camera rims (Surface Modification Technologies).
- Capital goods: precision moulds and tooling (TDConnex Chennai), power and control systems (Rockwell Automation India) and factory automation equipment (Wipro Pari Robotics).
Copper foil, cathode active material and specialty ceramics have been approved under ECMS for the first time.
With these, 118 applications covering 34 products across 16 states have been cleared under the scheme. Together they account for expected investment of ₹77,051 crore, projected production of ₹5,73,146 crore and direct employment for 81,755 people, according to MeitY.
Under the Chips to Startup programme, 332 institutions have been given access to chip design (EDA) tools and about 70,000 students have been trained so far, the ministry added.
Related: Narendra Modi inaugurates SEMICON India 2026, announces second phase of chip mission
Also read: Govt approves first batch of seven projects under Electronics Component Manufacturing Scheme